SEOUL, South Korea / RankWire.AI / – Samsung Electronics has unveiled new approaches to memory and storage technologies aimed at enhancing artificial intelligence systems. The company shared its plans at the 2026 OCP Global Summit in San Jose, California, held from October 12 to 15. Its roadmap emphasizes high-performance memory solutions, expansion capabilities via Compute Express Link, and next-generation solid-state drives. Additionally, Samsung will collaborate with AMD on a joint CXL demonstration. These initiatives are designed to address current AI server capacity limitations.
Samsung outlined its strategy around three core objectives: increasing speed, improving memory scalability, and ensuring data persistence. To boost speed, the company introduced customized high-bandwidth memory alongside the eighth-generation HBM5 technology. For scalability, CXL is promoted as a means to extend memory capacity beyond what is physically installed in each server. To enhance data persistence, Samsung presented next-generation SSD-based storage and management solutions. The company also showcased storage software aimed at optimizing data processing efficiency within AI systems.
Samsung pointed out that the increasing deployment of AI agents is creating a higher demand for memory during inference processes. Larger models generate more data when responding, necessitating that this data remain accessible to processors. Traditional systems restrict the amount of memory each processor can access, but Samsung demonstrated that CXL technology offers a practical solution to overcome this barrier. The company also highlighted key-value cache optimization, which enables AI models to reuse previously processed data rather than repeating computations.
Collaboration with AMD Expands into CXL Memory Expansion
A joint demonstration will be conducted by Samsung and AMD, showcasing a CXL-based solution that increases memory capacity in AI systems. This technology allows processors to share memory resources instead of relying solely on local server memory. Samsung confirmed that the solution has been validated in real system environments. The demonstration builds on a memorandum of understanding signed in March 2026 by both companies, focusing on next-generation AI memory and computing. On October 7, AMD CEO Lisa Su visited Korea and met with Jeon Young-hyun, Vice Chairman of Samsung’s Device Solutions division.
Memory pooling also played a significant role in Samsung’s presentation. The company showcased CMM-D, a CXL-based DRAM module that connects multiple memory units into a shared pool, allowing systems to access additional capacity as needed. In addition, Samsung displayed processing-in-memory technology, which performs certain calculations within memory chips to reduce data movement and conserve energy. Exhibits included 2-nanometer gate-all-around wafers, Groq LPU wafers, and Nvidia’s Groq 3 LPX system.
Early Co-Design Efforts Shape Samsung’s AI Memory Development Roadmap
During an executive session, Shim Ho-jun, Corporate Vice President and Head of Samsung’s Application Engineering Team, detailed the company’s plans. He emphasized that larger AI models and increased inference workloads heighten the importance of greater memory capacity and bandwidth for overall system performance. Shim also highlighted Samsung’s expanded co-design and validation collaborations with global partners from the earliest stages of development. The goal is to ensure that Samsung’s memory and storage offerings align more closely with customer system designs.
Samsung MAX Lab provides clients with a facility to evaluate memory and storage solutions under real-world AI workloads. It also offers co-design services tailored to specific system configurations. Customers can test pre-commercial technologies, including PIM and next-generation SSDs, before they are commercially available. Samsung participated in the summit as a Diamond Sponsor. This event follows its appearances in 2026 at Nvidia GTC, COMPUTEX, and the Future of Memory and Storage conference, as the company continues to strengthen its presence in AI memory development.